Transmission & 3D SFT?
The X2# is an advanced In-line X-RAY inspection system designed for high-speed automatic inspection in production lines. Transmission X-RAY technology is combined with patented Slice-Filter-Technology (SFT) for double-sided PCB assembly and component inspection. The X2# features fully automatic inspection based on a CAD compiled inspection list and uses an inspection model library for the test-strategy definition. The motion system as well as the image acquisition chain meets all demands of high-speed inspection.
X-ray System Features
? Flexible Inline AXI system
? 3-axes programmable motion system with variable FOV
? Maintenace free sealed tube and digital flatpanel technology
? In-line pass through board handling with automatic width adjust
? Automatic grey-level and geometrical calibration
? Full product traceability via customized MES-Interface (incl. 1D/2D barocescan)
? Optional: Combination with MatriX AOI module
APPLICATIONS
ELECTRONIC COMPONENTS AND SOLDER-JOINTS
A unique advanced algorithm library is available for electronic applications specifically for component and solder-joint inspection on PCB, hybrid or chip level assembly processes.
? All standard SMD components
? Specific BGA and QFN algorithms
? Cooling plates/heatsink void inspection
SPECIFICATIONS
Physical Dimension
Dimensions： 1670 mm (H) x 3100 mm (W) x 1760 mm (D)
Adjustable conveyor height： 890 – 980 mm
Weight： 3000 kg
Safe Operating Temperature： 15° - 32 °C，optimal 20° - 25° C
Power Consumption： max. 6 kW
Line Voltage： 400 VAC, 50/60 Hz 3 phase, 16 A，208 VAC, 50/60 Hz 3 phase, 25 A
Air： 5-7 Bar, < 2 l/min, filtered (30μ), dry, oil free
Motion System
High-speed sample table
Driving distance X,Y ： 510 x 410 mm
X-Ray tube (Z)： 0 - 150 mm
X-ray Source (sealed tube)
Energy ： 150 kV/75 W
Focal Spot Size： 5 - 7 microns
X-Ray Tube Orientation： End window tube
Digital Image Detector
Grey value resolution： 14 bit
Video output： Camera link interface
Detector Type A： CMOS Detector (1,5k x 1,5k)
Active inspection area： 115 x 115 mm
Image Performance
High-resolution setup
Transmission FoV： 0.4” (10 mm) to 1.2” (30 mm)
Object resolution (@min. FOV)： 3-5 μm
Sample Inspection Parameter
Max. board size： 20” x 16” (510 x 410 mm)
Min. board size： 4” x 3” (100 x 80 mm)
Max. inspection area： 19”x 16” (480 x 400 mm )
Max board weight： 11 lbs (5 kg)
Board thickness： 0.03” – 0.2” (0,8 – 5 mm)
Assembly Clearance
Topside (incl. board thickness)： 30 mm
Bottom side (excl. board thickness)： 50 mm
Edge clearance for clamping： 3 mm
Safety / Regulatory
Full safe, interlocked enclosure. Complies with all U.S. and International standards for cabinet radiography systems. CDRH directives / CE compliant.
